Amaoe A15 CPU BGA Reballing Stencil Platform For iPhone 13 Pro Max Phone PCB Fixture

Name: Amaoe A15 CPU BGA Reballing Stencil Platform For iPhone 13 Pro Max Phone PCB Fixture
Brand: arsbernard.com
SKU: 79126528279
Price: 25.55 USD
Availability: InStock
Rating: 4.4185 (15 reviews)

arsbernard.com

$ 25.55

Tax included. Shipping calculated at checkout.

Description

Amaoe A15 CPU BGA Reballing Stencil Platform For iPhone 13 Pro Max Phone PCB FixtureAmaoe A15 CPU BGA reballing stencil with positioning plate and metal base for iPhone 13 series CPU soldering repair. Amaoe A15 CPU BGA reballing stencil CPU upper lower layer tin planting steel mesh positioning plate magnet Base set for iPhone 13 mini 13 13 Pro 13 Pro Max. Amaoe 0. 12mm A15 CPU Low Layer BGA Reballing Stencil Platform for iPhone 13 Series. Options: 0. 12mm A15 lower stencil(half covered version). 0. 12mm A15 lower stencil(uncovered

STM32F100C6

020 adds new colors to GPT - cables:

BOSCH 30521 Car electronic IC can repair damaged automotive ECU drive chip

(Please note that the iPhone 17 series module do not come with a soldering mesh and can only be used for heating separation and bonding to the motherboard

Offers heat evenly to protect the motherboard or parts from damage

Firmware update

insulated protection pads to prevent scalding operation

Make your repair work easier

Greatly facilitate batch program

____EPROM-

four-speed adjustable

according to traces of forensic class of special purpose industries use

Easy Shipping

Quick Dispatch:

Your Amaoe A15 CPU BGA Reballing Stencil Platform For iPhone 13 Pro Max Phone PCB Fixture orders ship within 1-2 business days.

Delivery Options:

Standard: 3-7 business days
Fast: 2-3 business days
Express: 1-2 business days

Order Tracking:

You'll receive a tracking link by email once your Amaoe A15 CPU BGA Reballing Stencil Platform For iPhone 13 Pro Max Phone PCB Fixture ships.

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